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124,49€(IVA inc.)
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System–in–Package
- Keser, Beth
- 978-1-119-79377-9
- 2022-02-23
128,96€(IVA inc.)
Advances in Embedded and Fan-Out Wafer Level Packaging Technologies
- Keser, Beth
- 978-1-119-31413-4
- 2019-02-22