Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System–in–Package

Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System–in–Package

Keser, Beth
Kröhnert, Steffen

124,49 €(IVA inc.)
  • ISBN: 978-1-119-79377-9
  • Editorial: Wiley–Blackwell
  • Encuadernacion: Cartoné
  • Páginas: 320
  • Fecha Publicación: 23/02/2022
  • Nº Volúmenes: 1
  • Idioma: Inglés