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Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System–in–Package
Keser, Beth
Kröhnert, Steffen
124,49 €(IVA inc.)
- ISBN: 978-1-119-79377-9
- Editorial: Wiley–Blackwell
- Encuadernacion: Cartoné
- Páginas: 320
- Fecha Publicación: 23/02/2022
- Nº Volúmenes: 1
- Idioma: Inglés