Reliability and Failure of Electronic Materials and Devices

Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder jointsNew updated sections on failure physics, on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connectionsNew chapter on testing procedures, sample handling and sample selection, and experimental designCoverage of new packaging materials, including plastics and composites INDICE: CH 1 An Overview of Electronic Devices and Their ReliabilityCH 2 Electronic Devices: Materials Properties Determine How They Operate and Are FabricatedCH 3 Defects, Contamination and YieldCH 4 The Mathematics of Failure and ReliabilityCH 5 Mass Transport-Induced FailureCh 6 Electronic Charge-Induced DamageCH 7 Environmental Damage to Electronic ProductsCH 8 Packaging Materials, Processes, and StressesCH 9 Degradation of Contacts and PackagesCH 10 Degradation and Failure of Electro-Optical and Magnetic Materials and DevicesCH 11 Characterization and Failure Analysis of Material, Devices and PackagesCH 12 Future Directions and Reliability Issues

• ISBN: 978-0-12-810036-3
• Editorial: Academic Press
• Encuadernacion: Rústica
• Páginas: 750
• Fecha Publicación: 30/10/2017
• Nº Volúmenes: 1
• Idioma: Inglés